Hatched (Tracks/Arcs) – If this mode is selected the polygon is created from Track and Arc objects. The accuracy of these is defined by the Arc Approximation setting in the Polygon Pour dialog. Polygons of this type are generally faster to pour and result in smaller PCB and Gerber file sizes. Note that circular cutouts are not supported in the Gerber region definition, so the arcs (holes) for circular cutouts are actually approximated by straight chord sections. This type of polygon is output to Gerber using Gerber region definitions. Solid (Copper Regions) – If this mode is selected the Polygon is internally constructed from Solid Region objects, with a separate Region for each contiguous area of copper in the completed polygon. There are 3 supported Fill Modes, Solid, Hatched or None. Once the outline is complete, the polygon will automatically fill, in accordance with the Fill Mode and other options selected in the dialog. When you place a Polygon, you are defining the outline of the Polygon object. The Polygon Pour dialog, where you configure the properties of the polygon before placing it. Click OK and the cursor changes to a crosshair, ready to draw the Polygon outline. When the command is run the Polygon Pour dialog displays, where you set the fill and net connection options and pour-around properties. Select the Place » Polygon Pour command to place a Polygon on the current layer in the PCB Editor. Clearances and connection properties are controlled by the applicable Electrical Clearance and Polygon Connection Style design rules. As they are poured, Polygons automatically allow for clearances around electrical objects belonging to a different net, connect to objects of the same net, and fill irregularly shaped areas.
This article briefly discusses Fills and Solid Regions, and then explains how Polygon Pours (also called copper pours) are used to create regions of copper on a PCB. In Altium Designer areas of copper can be defined using three different design objects: Fills, Solid Regions and Polygon Pours. The advantage of a Polygon Pour is that it automatically pour around copper objects that belong to another net, in accordance with the applicable Electrical Clearance and Polygon Connect Style Design Rules.
It could be a hatched region of grounding copper on an analog design a large, solid region of copper for carrying heavy power supply currents or a solid ground area for EMC shielding. A common requirement on a printed circuit board is large areas of copper.